机械

[1]李力钧.现代激光加工及其装备[M],北京,北京理工大学出版社,1993:121-162.

[2]P.Sheng, andChryssolourisG.,Investigation of acoustic sensing for laser machining processses:Laser grooving and cutting,Journal ofMater.Process.Technol.1994,Vol.43:145-163.

[3]胡伦骥,王春明,骆红,等.激光切割的实时监测[J].应用激光,1998,Vol.18(4):164-166.

[4]王春明,胡伦骥,胡席远.国外激光实时监测技术的最新进展[J].激光技术,2001,Vol.25(6):412-416.

[5]HideyukiHorisawa,MasatakaTamura,SeiichiroKimura,Plasma behaviors in laser cutting,2000,Proc.SPIE,Vol.4088:280-283

[6]HansK.Toenshoff,AndreasOstendorf,BerndThiessen,ControlledCO2 laser cutting on the border to beginning of plasma,2001,Proc.SPIE,Vol.4276:80-89

[7]YuriT.Sukhov,I.V.Matiushin,Development of information-measuring channels of the monitoring system of quality cut for technological process laser cutting of materials,2001,Proc.SPIE,Vol.4157:88-92

[8]TsuneoKurita,TomohikoOno,TsuyoshiNakai,A study of processed area monitoring using the strength ofYAG laser processing sound,Journal ofMaterialsProcessingTechnology,2001,No.112:37-42.

[9]HeinzHaferkamp,MartinGoede,Alexander vonBusse,Quality monitoring and assurance for laser beam cutting using a thermographic process control,1999,Proc.SPIE,Vol.3824:383-391

[10]AbelsP.,KratzschC.,SchulzW.,Universal coaxial process control system for laser material processing.,Proc.ICALEO99, vol87(sectionE):99-108,

[11]梁耀荣.激光加工点温度测量装置的光学系统参数的计算与选定[J],航空精密制造技术,1997,Vol.33(1):19-21.

[12]IngoDecker,HolgerHeyn,DirkMartinen et al,Process monitoring in laser beam cutting on its way to industrial application,SPIE,1997,Vol.3097:29-37.

[13]H.Kaeberick,A.Jeromin,P.Mathew,Adaptive control for laser cutting using striation frequency analysis,Annals of theCIRP,1998,Vol.47:137-140.

[14]R.Poprawe,Modelling,monitoring and control in high quality laser cutting,Annals of theCIRP,2001,Vol.50(1):137-140.

[15]龚时华,朱国力,李培根,等.激光切割加工过程中等离子体对焦点位置检测干扰研究[J].机械与电子,1999,No.3:33-35.

[16]汤漾平,段正澄,李鹤九,多用途五轴联动激光加工系统[J].制造技术与机床,1997,No.11:12-13.

[17]徐正红,马积勋,李冬生.一种用于管材激光加工的光栅智能监控仪[J].仪表技术与传感器,1999,No.2:21-22.

[18]郭洁,白玮.激光加工中无接触光电跟踪系统的设计[J].天津城市建设学院学报,2000,Vol.6(2):119-121.